Mechanic XGSP30 Solder Paste 183C 20G

The Mechanic XGSP30 is a high-quality, no-clean solder paste formulated for precision SMD (Surface Mount Device) soldering and rework applications. Trusted by professional technicians and electronics enthusiasts alike, this paste delivers consistent, reliable solder joints with minimal flux residue — making it an excellent choice for PCB assembly, BGA rework, and component reflow work.

With a melting point of 183°C, the XGSP30 is compatible with standard lead-based soldering profiles, ensuring smooth reflow and excellent wetting performance on pads and component leads. The fine-grain alloy composition allows precise application through stencils or syringes, giving you full control over paste volume and placement.

Each jar contains 20 grams of paste — enough for extensive rework sessions or small-batch PCB production runs. Whether you’re a hobbyist building your first SMD project or a professional technician performing board-level repairs, the Mechanic XGSP30 offers the performance and consistency you need.

Specification:

• Brand : Mechanic
• Model : XGSP30
• Net Weight : 20G
• Melting Point : 183°C
• Alloy Composition : Sn63/Pb37
• Flux Type : No-Clean
• Particle Size : Type 4 (20–38 µm)
• Application : SMD Soldering, BGA Rework, PCB Assembly
• Storage Temperature : 0°C to +10°C (refrigerate when not in use)
• Shelf Life : 6 months (under recommended storage)