Solder Paste BA-6352

The BA-6352 Lead-Free Solder Paste is designed for precision electronics soldering, especially for SMD, SMT, and BGA applications. Formulated with a high-tin SAC305 alloy, it ensures strong, conductive, and reliable solder joints. This solder paste offers excellent wettability and smooth flow, allowing solder to spread evenly across pads and component leads. With a fine powder particle size of 20–28 µm, the BA-6352 paste supports high-accuracy work such as mobile phone motherboard repairs, laptop PCBs, and other compact electronic assemblies. Its halide-free, non-corrosive flux system produces minimal residue and is suitable for no-clean processes. Ideal for both rework and production environments, this solder paste provides consistent, professional-grade performance.

Specification :

• Model : BA-6352
• Alloy : SAC305 (96.5% Sn, lead-free)
• Powder Particle Size : 20 – 38 µm
• Flux Type : Halide-free, RoHS-compliant
• Appearance : Smooth solder paste
• Key Features : Excellent wetting, minimal residue, stable no-clean formulation