Solder Paste 40G 183C BST506

The BEST BST-506 BGA Solder Paste is a professional-grade, leaded solder paste designed for high-precision BGA (Ball Grid Array) reballing and SMD repair. Composed of a eutectic alloy of 63% Tin (Sn) and 37% Lead (Pb), this paste has a precise melting point of 183°C, allowing for fast and reliable soldering without damaging sensitive components. Its excellent wetting properties and no-clean formula ensure strong, bright, and reliable solder joints with minimal residue, making it an indispensable tool for mobile phone, computer, and other electronic chip-level repairs.

Specification :

• Model: BST-506
• Alloy Composition: Sn63/Pb37
• Type: Leaded Solder Paste
• Melting Point: 183°C
• Net Weight: 40g
• Application: BGA Reballing, SMD Chip Repair
• Features: Eutectic alloy, no-clean formula, excellent wettability